MIL-DTL-83454 Terminals, Stud, Blind Plate, For Electrical Bonding And Grounding \(Noninsulated\)This specification covers noninsulated blind plate stud terminals used for bonding and grounding of electrical and electronic systems in aircraft applications.

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MIL-DTL-83454A

4.5.2.1 Mounting examination. After mounting, stud terminals shall be visually

examined to verify that they have been installed properly and meet the specified dimensional

requirements for an installed terminal (see figure 1 and tables I through IV). Terminal studs that

fail to meet mounting criteria shall result in the rejection of the first article (see 4.3.4) or the lot

4.5.3 Voltage drop. The voltage drop of the stud terminal, when mounted as specified in

4.5.2, shall not exceed 7.5 millivolts maximum for the specified current rating as shown in

table VIII (see 3.5). The voltage drop shall be measured from a point at which the stud intersects

the sleeve shoulder to a point located on the mounting surface. Perform the measurement by

placing the first probe tip at the stud/sleeve shoulder intersection on the stud terminal; place the

second probe tip on the mounting surface. Ensure that the distance between probe tips is the

same distance as that from the first probe tip to the axis, or center line, of the stud (see figure 1).

Terminal studs failing the voltage drop test shall result in the rejection of the first article

(see 4.3.4) or the lot (see 4.4.2.2).

TABLE VIII. Stud terminal current ratings.

Current rating

(amperes)

Nominal stud size

(max)

.138-32 UNJC-3A

.164-32 UNJC-3A

.190-32 UNJF-3A

.250-28 UNJF-3A

4.5.4 Current cycling. When mounted as specified in 4.5.2, stud terminals shall be

placed in a gravity convection chamber with an internal temperature of 130 �2 �F (55 �1 �C)

(see 3.10). Following temperature stabilization, the specimens shall then be subjected to 50

current cycles. Each cycle shall consist of 30 minutes at 140 percent of the test current specified

in 4.5.3, followed by 15 minutes at no load. Following the current cycling test, the test samples

shall he allowed to cool to room temperature and the voltage drop test shall be performed in

accordance with 4.5.3. Terminal studs showing evidence of electrical or physical damage, or

that fail to pass the follow-on voltage drop test, shall result in the rejection of the first article

4.5.5 Thermal shock. Terminals shall be tested in accordance with method 107 of

MIL-STD-202 (see 3.6). The following details shall apply:

(a) Mounting of specimens - As specified in 4.5.2.

(b) Measurements before cycling - Not applicable.

(d) Type of test - Liquid or air (see 6.2).

(e) Examinations after cycling - Stud terminals shall be visually examined for evidence

of cracking, loosening, or other physical damage. Terminal studs exhibiting such mechanical